D.I.C. Digital Image Correlation

Digital Image Correlation (DIC) paired with ultra-high-speed imaging elevates structural mechanics from point-based strain gauges to continuous, full-field optical deformation mapping. By tracking stochastic speckle patterns at tens of thousands of frames per second, multi-camera stereo-DIC systems deliver precise 3D surface displacement, velocity, and strain tensor fields under dynamic shock and high-strain-rate loads.

• Dynamic Tensile & High-Strain-Rate Testing: Measures localized necking, yield strain, and plastic deformation during Hopkinson Bar (SHPB), drop weight, or high-speed hydraulic tensile tests.
• Dynamic Fracture Mechanics & Crack Propagation: Visualizes high-velocity crack tip paths, branching, and energy release rates in brittle materials, bonded joints, and advanced structural adhesives.
• Composite Material Delamination: Quantifies out-of-plane displacement and dynamic inter-laminar shear stress in carbon fiber and polymer matrix composites subjected to high-G impact.
• FEA & Numerical Model Validation: Directly overlays full-field optical strain tensor maps onto finite element simulations to calibrate boundary conditions and eliminate constitutive model discrepancies.
• Vibration Mode & Modal Shape Analysis: Tracks operational deflection shapes (ODS) and micro-vibrations across complex structures without the mass-loading errors introduced by physical accelerometers.